Wafer connectors have the following core advantages:

High density and spatial optimization

The Wafer connector adopts a precision arranged contact point design, which can achieve high-density connections in a limited space and is suitable for miniaturized devices. For example, the foldable screen cable connector for smartphones saves space through high-density design and meets the compact requirements of portable devices.  ‌

Durability and reliability

Using industrial grade materials (such as phosphor bronze or beryllium copper) and precision manufacturing processes, it ensures a plug-in life of over 10000 times, while also being resistant to high temperatures (LCP material can withstand 260 ℃), moisture and dust, and suitable for harsh environments such as industry and automobiles.  ‌

High speed transmission and low loss

Gold plated terminal design reduces contact resistance (preferably with a 0.3 μ m coating) and is suitable for high-frequency signal transmission; Precision machining technology reduces signal delay and is suitable for scenarios such as computers and communication equipment.  ‌

Convenient installation and maintenance

Plug in design simplifies installation process and reduces maintenance costs; Standardized interface design enhances compatibility, facilitating mass production and rapid deployment.  ‌

Cost effectiveness

Large scale production reduces manufacturing costs and meets the demand for cost-effectiveness in consumer electronics and industrial equipment; Simultaneously supporting modular design, flexibly adapting to different power scenarios.  ‌‌