SMT (Surface Mount) and DIP (Dual In Line) are the two main installation methods for FPC connectors, with the following differences:

The characteristics of SMT (Surface Mount Technology) are that components are directly soldered onto the surface of the PCB and fixed using reflow soldering technology, which has the advantages of small size, light weight, and high degree of automation.  ‌

Applicable scenarios: Suitable for high-density, miniaturized electronic devices such as smartphones, tablets, etc.  ‌

The advantage of DIP (Dual In Line) is that after the component pins are inserted into the PCB through holes, they need to be soldered and installed through wave soldering or manual insertion, making maintenance and replacement more convenient.  ‌

Applicable scenarios: Suitable for components with long pins and large volume, such as electrolytic capacitors, transformers, etc., commonly used in industrial control equipment and other scenarios with high reliability requirements.  ‌

Both types can be used for FPC connectors, and the specific selection needs to be based on component size, installation space, and reliability requirements.